The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Apr. 11, 2022
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Cheng-Chi Chuang, New Taipei, TW;
Lin-Yu Huang, Hsinchu, TW;
Chia-Hao Chang, Hsinchu, TW;
Yu-Ming Lin, Hsinchu, TW;
Ting-Ya Lo, Hsinchu, TW;
Chi-Lin Teng, Taichung, TW;
Hsin-Yen Huang, New Taipei, TW;
Hai-Ching Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a substrate, a semiconductor layer, a gate stack, two first gate spacers over two opposing sidewalls of the gate stack and extending above the gate stack; a second gate spacer over a sidewall of one of the first gate spacers and having an upper portion over a lower portion; an etch stop layer adjacent to the lower portion and spaced away from the upper portion; and a seal layer over the gate stack, the two first gate spacers and the second gate spacer, resulting in a first void and a second void below the first seal layer. The first void is above the lower portion of the second gate spacer and laterally between the etch stop layer and the upper portion of the second gate spacer. The second void is above the gate stack and laterally between the two first gate spacers.