The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 18, 2024

Filed:

Nov. 01, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Leonard P. Guler, Hillsboro, OR (US);

Biswajeet Guha, Hillsboro, OR (US);

Mark Armstrong, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

William Hsu, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 21/308 (2006.01); H01L 27/088 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823456 (2013.01); H01L 21/3083 (2013.01); H01L 21/3086 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/66484 (2013.01); H01L 29/7831 (2013.01);
Abstract

Fabrication of narrow and wide structures based on lithographic patterning of exclusively narrow mask structures. Multi-patterning may be employed to define narrow mask structures. Wide mask structures may be derived through a process-based merging of multiple narrow mask structures. The merge may include depositing a cap layer over narrow structures, filling in minimum spaces. The cap layer may be removed leaving residual cap material only within minimum spaces. Narrow and wide structures may be etched into an underlayer based on a summation of the narrow mask structures and residual cap material. A plug pattern may further mask portions of the cap layer not completely filling space between adjacent mask structures. The underlayer may then be etched based on a summation of the narrow mask structures, plug pattern, and residual cap material. Such methods may be utilized to integrate nanoribbon transistors with nanowire transistors in an integrated circuit (IC).


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