The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2024

Filed:

Jun. 19, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Nazila Haratipour, Portland, OR (US);

Shriram Shivaraman, Hillsboro, OR (US);

Sou-Chi Chang, Portland, OR (US);

Jack T. Kavalieros, Portland, OR (US);

Uygar E. Avci, Portland, OR (US);

Chia-Ching Lin, Portland, OR (US);

Seung Hoon Sung, Portland, OR (US);

Ashish Verma Penumatcha, Beaverton, OR (US);

Ian A. Young, Portland, OR (US);

Devin R. Merrill, McMinnville, OR (US);

Matthew V. Metz, Portland, OR (US);

I-Cheng Tung, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 53/30 (2023.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H10B 53/30 (2023.02); H01L 21/7687 (2013.01); H01L 23/5226 (2013.01); H01L 21/76843 (2013.01);
Abstract

Described herein are ferroelectric (FE) memory cells that include transistors having gate stacks separate from FE capacitors of these cells. An example memory cell may be implemented as an IC device that includes a support structure (e.g., a substrate) and a transistor provided over the support structure and including a gate stack. The IC device also includes a FE capacitor having a first capacitor electrode, a second capacitor electrode, and a capacitor insulator of a FE material between the first capacitor electrode and the second capacitor electrode, where the FE capacitor is separate from the gate stack (i.e., is not integrated within the gate stack and does not have any layers that are part of the gate stack). The IC device further includes an interconnect structure, configured to electrically couple the gate stack and the first capacitor electrode.


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