The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Mar. 21, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Wei-Chih Chen, Taipei, TW;
Hung-Jui Kuo, Hsinchu, TW;
Yu-Hsiang Hu, Hsinchu, TW;
Sih-Hao Liao, New Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 24/19 (2013.01); H01L 24/02 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 23/295 (2013.01); H01L 24/13 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0236 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/024 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2405 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24265 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/2518 (2013.01); H01L 2924/0645 (2013.01); H01L 2924/066 (2013.01); H01L 2924/0665 (2013.01);
Abstract
A die includes a substrate, a conductive pad, a connector and a protection layer. The conductive pad is disposed over the substrate. The connector is disposed on the conductive pad. The connector includes a seed layer and a conductive post. The protection layer laterally covers the connector. Topmost surfaces of the seed layer and the conductive post and a top surface of the protection layer are level with each other.