The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Dec. 12, 2022
Intel Corporation, Santa Clara, CA (US);
Md Altaf Hossain, Portland, OR (US);
Ankireddy Nalamalpu, Portland, OR (US);
Dheeraj Subbareddy, Portland, OR (US);
Robert Sankman, Phoenix, AZ (US);
Ravindranath V. Mahajan, Chandler, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Ram S. Viswanath, Phoenix, AZ (US);
Sandeep B. Sane, Chandler, AZ (US);
Sriram Srinivasan, Chandler, AZ (US);
Rajat Agarwal, Portland, OR (US);
Aravind Dasu, Milpitas, CA (US);
Scott Weber, Piedmont, CA (US);
Ravi Gutala, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.