The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jul. 14, 2021
Applicant:

Globalwafers Co., Ltd., Hsinchu, TW;

Inventors:

Ying-Ru Shih, Hsinchu, TW;

Chih-Yuan Chuang, Hsinchu, TW;

Chi-Tse Lee, Hsinchu, TW;

Chun-I Fan, Hsinchu, TW;

Wen-Ching Hsu, Hsinchu, TW;

Assignee:

GlobalWafers Co., Ltd., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); B32B 3/02 (2006.01); B32B 18/00 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); B32B 3/02 (2013.01); B32B 18/00 (2013.01); H01L 21/02021 (2013.01); H01L 21/26506 (2013.01); H01L 29/04 (2013.01); H01L 29/0603 (2013.01); B32B 2250/02 (2013.01); B32B 2307/20 (2013.01);
Abstract

A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.


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