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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11646228 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Jul. 13, 2020

Stealth dicing method including filamentation and apparatus thereof

Applicants:

Chongqing Institute of East China Normal University, Chongqing, CN;

East China Normal University, Shanghai, CN;

University of Shanghai for Science and Technology, Shanghai, CN;

Inventors:

Heping Zeng, Chongqing, CN;

Shuai Yuan, Chongqing, CN;

Yingsheng Du, Chongqing, CN;

Hui Xu, Chongqing, CN;

Yuan Nie, Chongqing, CN;

Yong Wang, Chongqing, CN;

Jin Wang, Chongqing, CN;

Jue Yu, Chongqing, CN;

Yanying Ma, Chongqing, CN;

Assignees:

CHONGQING INSTITUTE OF EAST CHINA NORMAL UNIVERSITY, Chongqing, CN;

EAST CHINA NORMAL UNIVERSITY, Shanghai, CN;

UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY, Shanghai, CN;

Attorney:

Hodgson Russ LLP

Primary Examiner:

John P Dulka

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/268 (2006.01); B23K 26/064 (2014.01); B23K 26/08 (2014.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/402 (2014.01); B23K 26/53 (2014.01); B23K 26/073 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/064 (2015.10); B23K 26/0624 (2015.10); B23K 26/0665 (2013.01); B23K 26/073 (2013.01); B23K 26/0861 (2013.01); B23K 26/402 (2013.01); B23K 26/53 (2015.10); H01L 21/268 (2013.01); B23K 2103/50 (2018.08); B23K 2103/56 (2018.08);
Abstract

The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing.

Find Patent Forward Citations

Zeng, Heping. (2023). Stealth dicing method including filamentation and apparatus thereof (U.S. Patent No. 11646228). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11646228

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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