Chongqing, China

Yuan Nie

This inventor holds 1 USPTO granted patent. Top assignees: Chongqing Institute of East China Normal University, East China Normal University, University of Shanghai for Science and Technology. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuan Nie. Retrieved from https://idiyas.com/inventor/yuan-nie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations of Yuan Nie in Stealth Dicing Technology

Introduction

Yuan Nie is a notable inventor based in Chongqing, China. He has made significant contributions to the field of material processing, particularly through his innovative patent related to stealth dicing methods.

Latest Patents

Yuan Nie holds a patent for a "Stealth dicing method including filamentation and apparatus thereof." This invention provides a unique approach to dicing materials by utilizing a laser beam focused on the surface of the material. The method involves creating a dynamic-equilibrium plasma channel within the material, which is achieved through the self-focusing and defocusing effects of plasma generated by ionizing the material. This technique allows for the formation of a modified layer throughout the plasma channel, enabling stealth dicing.

Career Highlights

Throughout his career, Yuan Nie has worked at prestigious institutions, including the Chongqing Institute of East China Normal University and East China Normal University. His work has been instrumental in advancing the understanding and application of laser technology in material processing.

Collaborations

Yuan Nie has collaborated with notable colleagues such as Heping Zeng and Shuai Yuan, contributing to various research projects and innovations in the field.

Conclusion

Yuan Nie's contributions to stealth dicing technology exemplify the innovative spirit of modern inventors. His work not only enhances material processing techniques but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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