This inventor holds 1 USPTO granted patent. Top assignees: Chongqing Institute of East China Normal University, East China Normal University, University of Shanghai for Science and Technology. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2023
Title: Yingsheng Du: Innovator in Stealth Dicing Technology
Introduction
Yingsheng Du is a notable inventor based in Chongqing, China. He has made significant contributions to the field of material processing, particularly through his innovative stealth dicing method. His work has implications for various industries, enhancing the precision and efficiency of material cutting techniques.
Latest Patents
Yingsheng Du holds a patent for a "Stealth dicing method including filamentation and apparatus thereof." This patent describes a method where a focusing element directs a laser beam onto the surface of the material to be diced. The process involves creating a dynamic-equilibrium plasma channel within the material, achieved through the self-focusing and defocusing effects of plasma generated by ionization. This innovative approach allows for the formation of a modified layer throughout the plasma channel, enabling stealth dicing.
Career Highlights
Throughout his career, Yingsheng Du has been associated with prestigious institutions such as the Chongqing Institute of East China Normal University and East China Normal University. His work at these institutions has allowed him to advance his research and contribute to the academic community.
Collaborations
Yingsheng Du has collaborated with notable colleagues, including Heping Zeng and Shuai Yuan. Their joint efforts have furthered the development of advanced technologies in material processing.
Conclusion
Yingsheng Du's innovative contributions to stealth dicing technology highlight his role as a leading inventor in the field. His patent and collaborative efforts reflect a commitment to advancing material processing techniques.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile