Chongqing, China

Hui Xu

This inventor holds 1 USPTO granted patent. Top assignees: Chongqing Institute of East China Normal University, East China Normal University, University of Shanghai for Science and Technology. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hui Xu. Retrieved from https://idiyas.com/inventor/hui-xu-rudgv2md

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Hui Xu - Innovator in Stealth Dicing Technology

Introduction

Hui Xu is a notable inventor based in Chongqing, China. He has made significant contributions to the field of material processing, particularly through his innovative stealth dicing method. His work has implications for various industries, including electronics and materials science.

Latest Patents

Hui Xu holds a patent for a "Stealth dicing method including filamentation and apparatus thereof." This patent describes a method where a focusing element directs a laser beam onto the surface of the material to be diced. The process involves creating a dynamic-equilibrium plasma channel within the material, achieved through the self-focusing and defocusing effects of plasma generated by ionizing the material. This technique allows for the formation of a modified layer throughout the plasma channel, enabling stealth dicing.

Career Highlights

Hui Xu has worked at the Chongqing Institute of East China Normal University and East China Normal University. His experience in these institutions has contributed to his expertise in advanced material processing techniques.

Collaborations

Hui Xu has collaborated with notable colleagues, including Heping Zeng and Shuai Yuan, who have contributed to his research and development efforts.

Conclusion

Hui Xu's innovative work in stealth dicing technology showcases his commitment to advancing material processing methods. His contributions are paving the way for new applications in various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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