The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Aug. 25, 2020
Semes Co., Ltd., Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Chang Bu Jeong, Gyeonggi-do, KR;
Min Gu Lee, Chungcheongnam-do, KR;
Eui Sun Choi, Seoul, KR;
Kang San Lee, Gyeonggi-do, KR;
Dae Ho Min, Seoul, KR;
Seung Dae Seok, Gyeonggi-do, KR;
Semes Co., Ltd, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.