Kang San Lee

Title: Innovations by Kang San Lee

Introduction

Kang San Lee is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of technology, particularly in the area of die bonding apparatuses. With a total of 2 patents to his name, his work has garnered attention in the industry.

Latest Patents

Kang San Lee's latest patents include a die pickup module and a die bonding apparatus that incorporates innovative features. The die pickup module is designed to support a wafer that includes dies attached to a dicing tape. It features a die ejector positioned beneath the dicing tape, which separates a die for pickup. A non-contact picker is utilized to pick up the die without making contact with its front surface. Additionally, a vertical driving unit allows for vertical movement of the non-contact picker to facilitate the pickup process. An inverting driving unit is also included to invert the die once it has been picked up.

Career Highlights

Throughout his career, Kang San Lee has worked with prominent companies such as Semes Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has contributed to his expertise in the field of technology and innovation.

Collaborations

Kang San Lee has collaborated with notable coworkers, including Chang B Jeong and Min Gu Lee. These collaborations have likely played a role in the development of his innovative patents.

Conclusion

Kang San Lee is a distinguished inventor whose work in die bonding technology has made a significant impact. His patents reflect his commitment to innovation and excellence in the field.