Min Gu Lee

Title: Min Gu Lee: Innovator in Die Pickup Technology

Introduction

Min Gu Lee is a prominent inventor based in Chungcheongnam-ro, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in die pickup modules and bonding apparatuses. With a total of 2 patents, his work has advanced the efficiency and precision of die handling in manufacturing processes.

Latest Patents

Min Gu Lee's latest patents include innovative designs for a die pickup module and a die bonding apparatus. The die pickup module features a wafer stage that supports a wafer with dies attached to a dicing tape. It incorporates a die ejector positioned beneath the dicing tape to separate a die for pickup. A non-contact picker is utilized to pick up the die without making contact with its front surface. Additionally, the module includes a vertical driving unit for moving the non-contact picker vertically and an inverting driving unit to invert the die after it has been picked up. This technology enhances the handling of delicate semiconductor dies, ensuring their integrity during the manufacturing process.

Career Highlights

Throughout his career, Min Gu Lee has worked with notable companies such as Semes Co., Ltd. and Samsung Electronics Co., Ltd. His experience in these leading organizations has equipped him with the expertise necessary to innovate in the semiconductor industry.

Collaborations

Min Gu Lee has collaborated with esteemed colleagues, including Chang B Jeong and Eui Sun Choi. These partnerships have contributed to the development of advanced technologies in the field.

Conclusion

Min Gu Lee's contributions to die pickup technology exemplify his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in die handling, making him a key figure in this field.