Seoul, South Korea

Chang B Jeong


Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Seoul, KR (1995)
  • Gyeonggi-do, KR (2023)

Company Filing History:


Years Active: 1995-2024

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4 patents (USPTO):Explore Patents

Title: Inventor Profile: Chang B Jeong from Seoul, KR

Introduction

Chang B Jeong is an innovative inventor based in Seoul, South Korea. With a keen focus on advancements in technology, he holds a total of four patents, showcasing his significant contributions to the field. His most recent work emphasizes the design of modules and apparatuses that enhance the efficiency of die bonding processes.

Latest Patents

Recently, Chang B Jeong has developed a notable patent for a die pickup module and a die bonding apparatus, which incorporates a variety of sophisticated features. The die pickup module consists of a wafer stage that supports a wafer containing dies attached to a dicing tape. It includes a die ejector that separates a die for pickup, a non-contact picker designed to grasp the die without making physical contact with its front surface, along with a vertical driving unit that facilitates movement in a vertical direction. Additionally, an inverting driving unit allows for the inversion of the non-contact picker once it has securely picked up a die. This innovative approach not only minimizes handling damage but also improves overall efficiency in die bonding processes.

Career Highlights

Throughout his career, Chang B Jeong has made significant strides in the tech industry. He has worked for esteemed companies such as Samsung Electronics Co., Ltd. and Semes Co., Ltd., where he honed his skills and contributed to significant projects and innovations.

Collaborations

During his professional journey, Chang has collaborated with notable colleagues, including Chang Seob Song and Eui Sun Choi. These partnerships underscore his ability to work alongside talented individuals within the same field, fostering an environment of creativity and collaboration.

Conclusion

Chang B Jeong exemplifies the spirit of innovation in the tech industry, with his contributions paving the way for improvements in die bonding technologies. His dual focus on functionality and efficiency through his recent patents demonstrates his commitment to advancing the field. As he continues to push the boundaries of technology, the impact of his inventions is likely to inspire future advancements in the industry.

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