Samsung Electronics Co., Ltd.

Semes Co., Ltd.

Chang B Jeong

Chang Seob Song

Seung Dae Seok

Eui Sun Choi

Kang San Lee

Min Gu Lee

Dae Ho Min

Jong Sung Park

Jung Sub Kim

Dae Seok Choi

Young Gun Park

Sang Hoon Jung

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

Die pickup module and die bonding apparatus including the same

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.

A manufacturing method for a thin film resistor is disclosed. An insulating layer is formed on a substrate having a contact region. The insulating layer above the contact region is removed by etching to expose the contact region. A metal layer and an interlayer are then formed in sequence on the surface of the structure. The metal layer and the interlayer above the region where the resistor will be formed is next removed, and then a resistor layer is formed on the surface of the structure. The thin film resistor is completed by etching away the resistor layer except for the predetermined region where the resistor is to be formed.

Semiconductor device having a thin-film resistor

Manufacturing method of a thin film resistor

Growing community of inventors

Seoul, South Korea

Chang B Jeong