This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignees: Samsung Electronics Co., Ltd., Semes Co., Ltd.. Active years: 2016-2024.
Location History:
- Yongin-si, KR (2016)
- Suwon-si, KR (2017)
- Gyeonggi-do, KR (2023)
Company Filing History:
4 out of 132,108 
3 out of 802 
Years Active: 2016-2024
Title: Seung Dae Seok: A Pioneer in Die Pickup Module Technology
Introduction
Seung Dae Seok is an accomplished inventor based in Suwon-si, South Korea, with a notable portfolio comprising four patents. His work primarily focuses on advancements in die bonding technology, which is critical in the semiconductor manufacturing industry.
Latest Patents
Among his most recent inventions, Seung Dae Seok has developed a die pickup module and a die bonding apparatus that includes innovative features. This die pickup module is designed to support a wafer with dies affixed to a dicing tape. Essential components of the invention include a die ejector positioned beneath the dicing tape to separate a die for pickup, and a non-contact picker that can retrieve the die without making contact with its front surface. The module also features a vertical driving unit for moving the non-contact picker and an inverting driving unit that allows for the inversion of the die after it has been picked up. Additionally, a vacuum gripper is utilized to partially vacuum adsorb the rear surface of the die, ensuring a more efficient and gentle handling process.
Career Highlights
Seung Dae Seok's innovative contributions to the field are greatly aided by his experiences at leading technology companies. He has worked with Samsung Electronics Co., Ltd. and Semes Co., Ltd., gaining valuable insights and skills that he has applied to his patented inventions.
Collaborations
Throughout his career, Seung Dae Seok has collaborated with esteemed colleagues, including Chang B Jeong and Min Gu Lee. These partnerships have facilitated the exchange of ideas and have contributed to the successful development of his innovative technologies.
Conclusion
Seung Dae Seok stands out as a significant figure in the realm of semiconductor technology through his inventive work on die pickup modules. His patents not only reveal his commitment to innovation but also highlight the importance of collaboration in driving technological advancements. As the industry continues to evolve, his contributions are sure to make a lasting impact.