Eui Sun Choi

Title: Eui Sun Choi: Innovator in Die Pickup Technologies

Introduction

Eui Sun Choi is an accomplished inventor based in Seoul, South Korea, holding three patents to his name. His contributions to the field of technology, particularly in die pickup modules and bonding apparatuses, have significantly influenced modern manufacturing processes.

Latest Patents

Among Eui Sun Choi's latest patents is the innovative design of a die pickup module and a die bonding apparatus, which he has developed to improve efficiency in semiconductor manufacturing. The die pickup module includes a sophisticated wafer stage for supporting a wafer with dies attached to a dicing tape. It features a die ejector positioned beneath the dicing tape, designed to separate a die for pickup. A non-contact picker removes the die without touching its front surface, ensuring the integrity of the component. Additionally, a vertical driving unit enables vertical movement to facilitate die retrieval, while an inverting driving unit allows for the inversion of the picker to orient the die correctly.

Career Highlights

Eui Sun Choi has made a mark in his career through his work with renowned companies such as Samsung Electronics Co., Ltd. and Semes Co., Ltd. His expertise in developing advanced technologies has made him a valuable asset in the engineering and manufacturing sectors.

Collaborations

Throughout his career, Eui Sun Choi has collaborated with notable colleagues, including Kang San Lee and Dae Ho Min. These partnerships have led to innovative advancements and successful projects, highlighting the collaborative spirit prevalent in the tech community.

Conclusion

Eui Sun Choi's contributions to the field of die pickup technologies exemplify the impactful innovations that propel the semiconductor industry forward. His patents not only showcase his inventive prowess but also demonstrate the importance of collaboration and expertise in achieving technological advancements.