Samsung Electronics Co., Ltd.

Semes Co., Ltd.

Eui Sun Choi

Seung Dae Seok

Chang B Jeong

Min Gu Lee

Dae Ho Min

Kang San Lee

Jong Woo Lee

Jong Sung Park

Jung Sub Kim

Dong Min Kim

Young Tae Cho

Jeong Gil Kim

Eun Soo Hwang

Dae Seok Choi

Young Gun Park

Eun Ah Park

Sang Hoon Jung

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

Die pickup module and die bonding apparatus including the same

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.

Disclosed herein is a patterning mold configured to form a micropattern on a substrate or glass. The disclosed patterning mold includes a transfer body with a patterning part formed at one end of the transfer body to transfer a nanoparticle material to one surface of the substrate. The patterning mold further includes a fixing member coupled to an exterior of the transfer body, to prevent or reduce deformation of the exterior of the transfer body.

Patterning mold and manufacturing method thereof

Growing community of inventors

Seoul, South Korea

Eui Sun Choi