The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Jun. 25, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Seok Ling Lim, Kulim, MY;
Jenny Shio Yin Ong, Bayan Lepas, MY;
Bok Eng Cheah, Bukit Gambir, MY;
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/76 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/76838 (2013.01); H01L 23/5283 (2013.01);
Abstract
Disclosed embodiments include frame-array interconnects that have a ledge portion to accommodate a passive device. A seated passive device is between at least two frame-array interconnects for semiconductor package-integrated decoupling capacitors.