The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2022
Filed:
Aug. 10, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Zhimin Wan, Chandler, AZ (US);
Je-Young Chang, Phoenix, AZ (US);
Chia-Pin Chiu, Tempe, AZ (US);
Shankar Devasenathipathy, Tempe, AZ (US);
Betsegaw Kebede Gebrehiwot, Chandler, AZ (US);
Chandra Mohan Jha, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 25/18 (2013.01);
Abstract
Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.