The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Oct. 19, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Jian Zhang, Koshi, JP;

Takao Inada, Koshi, JP;

Hisashi Kawano, Koshi, JP;

Seigo Fujitsu, Koshi, JP;

Hideaki Sato, Koshi, JP;

Teruaki Konishi, Koshi, JP;

Toshiyuki Shiokawa, Koshi, JP;

Koji Ogura, Koshi, JP;

Hiroshi Yoshida, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67086 (2013.01); H01L 21/30604 (2013.01); H01L 21/31111 (2013.01); H01L 21/67017 (2013.01); H01L 21/67173 (2013.01);
Abstract

A substrate processing apparatus, a substrate processing method and a recording medium capable of shortening an etching processing time are provided. The substrate processing apparatus includes a substrate processing tub, a mixing unit and a supply line. The substrate processing tub is configured to perform an etching processing therein with an etching liquid. The mixing unit is configured to mix a new liquid with a silicon-containing compound or a liquid containing the silicon-containing compound. The supply line is configured to supply a mixed solution mixed by the mixing unit into the substrate processing tub.


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