The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Apr. 17, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Eric Chih-Fang Liu, Albany, NY (US);

Akiteru Ko, Albany, NY (US);

Angelique Raley, Albany, NY (US);

Henan Zhang, Albany, NY (US);

Shan Hu, Albany, NY (US);

Subhadeep Kal, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01); H01L 21/67 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0337 (2013.01); H01L 21/0273 (2013.01); H01L 21/3065 (2013.01); H01L 21/30608 (2013.01); H01L 21/31116 (2013.01); H01L 21/32136 (2013.01); H01L 21/67075 (2013.01);
Abstract

In certain embodiments, a method of forming a semiconductor device includes forming a patterned resist layer over a hard mask layer using an extreme ultraviolet (EUV) lithography process. The hard mask layer is disposed over a substrate. The method includes patterning the hard mask layer using the patterned resist layer as an etch mask. The method includes smoothing the hard mask layer by forming, using a first atomic layer etch step, a first layer by converting a first portion of the hard mask layer, and by removing, using a second atomic layer etch step, the first layer.


Find Patent Forward Citations

Loading…