The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2022

Filed:

Jun. 14, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Chia-Ching Lin, Portland, OR (US);

Sasikanth Manipatruni, Portland, OR (US);

Tanay Gosavi, Hillsboro, OR (US);

Dmitri Nikonov, Beaverton, OR (US);

Benjamin Buford, Hillsboro, OR (US);

Kaan Oguz, Portland, OR (US);

John J. Plombon, Portland, OR (US);

Ian A. Young, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/16 (2006.01); H01L 43/02 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
G11C 11/161 (2013.01); H01L 43/02 (2013.01); H01L 43/10 (2013.01);
Abstract

An apparatus is provided which comprises: a stack comprising a magnetic insulating material (MI such as EuS, EuO, YIG, TmIG, or GaMnAs) and a transition metal dichalcogenide (TMD such as MoS, MoSe, WS, WSe, PtS, PtSe, WTe, MoTe, or graphene), wherein the magnetic insulating material has a first magnetization; a magnet with a second magnetization, wherein the magnet is adjacent to the TMD of the stack; and an interconnect comprising a spin orbit material, wherein the interconnect is adjacent to the magnet.


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