The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jun. 01, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hung-Chang Sun, Kaohsiung, TW;

Po-Chin Chang, Taichung, TW;

Akira Mineji, Hsinchu County, TW;

Zi-Wei Fang, Hsinchu County, TW;

Pinyen Lin, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 23/532 (2006.01); H01L 23/535 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76837 (2013.01); H01L 21/76804 (2013.01); H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 21/76825 (2013.01); H01L 21/76829 (2013.01); H01L 21/76895 (2013.01); H01L 21/823437 (2013.01); H01L 21/823475 (2013.01); H01L 23/535 (2013.01); H01L 23/53295 (2013.01); H01L 27/088 (2013.01);
Abstract

A semiconductor structure includes a semiconductor substrate, a gate structure, an etch stop layer, a dielectric structure, and a conductive material. The gate structure is on the semiconductor substrate. The etch stop layer is over the gate structure. The dielectric structure is over the etch stop layer, in which the dielectric structure has a ratio of silicon to nitrogen varying from a middle layer of the dielectric structure to a bottom layer of the dielectric structure. The conductive material extends through the dielectric structure.


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