The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Nov. 04, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chun Hsiung Tsai, Hsinchu County, TW;

Cheng-Yi Peng, Taipei, TW;

Yin-Pin Wang, Kaohsiung, TW;

Kuo-Feng Yu, Hsinchu County, TW;

Da-Wen Lin, Hsinchu, TW;

Jian-Hao Chen, Hsinchu, TW;

Shahaji B. More, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 21/768 (2006.01); H01L 21/223 (2006.01);
U.S. Cl.
CPC ...
H01L 29/665 (2013.01); H01L 21/2236 (2013.01); H01L 21/2652 (2013.01); H01L 21/26513 (2013.01); H01L 21/324 (2013.01); H01L 21/76802 (2013.01); H01L 21/76804 (2013.01); H01L 21/76825 (2013.01); H01L 21/76831 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 29/66515 (2013.01); H01L 29/66795 (2013.01);
Abstract

A method and structure for doping source and drain (S/D) regions of a PMOS and/or NMOS FinFET device are provided. In some embodiments, a method includes providing a substrate including a fin extending therefrom. In some examples, the fin includes a channel region, source/drain regions disposed adjacent to and on either side of the channel region, a gate structure disposed over the channel region, and a main spacer disposed on sidewalls of the gate structure. In some embodiments, contact openings are formed to provide access to the source/drain regions, where the forming the contact openings may etch a portion of the main spacer. After forming the contact openings, a spacer deposition and etch process may be performed. In some cases, after performing the spacer deposition and etch process, a silicide layer is formed over, and in contact with, the source/drain regions.


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