The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Jun. 17, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sean T. Ma, Portland, OR (US);

Matthew V. Metz, Portland, OR (US);

Willy Rachmady, Beaverton, OR (US);

Gilbert Dewey, Hillsboro, OR (US);

Chandra S. Mohapatra, Beaverton, OR (US);

Jack T. Kavalieros, Portland, OR (US);

Anand S. Murthy, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 21/8258 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/161 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1054 (2013.01); H01L 21/02532 (2013.01); H01L 21/02546 (2013.01); H01L 21/02639 (2013.01); H01L 21/8258 (2013.01); H01L 27/0924 (2013.01); H01L 29/0653 (2013.01); H01L 29/161 (2013.01); H01L 29/20 (2013.01); H01L 29/66522 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

Monolithic FETs including a fin of a first semiconductor composition disposed on a sub-fin of a second composition. In some examples, an InGaAs fin is grown over GaAs sub-fin. The sub-fin may be epitaxially grown from a seeding surface disposed within a trench defined in an isolation dielectric. The sub-fin may be planarized with the isolation dielectric. The fin may then be epitaxially grown from the planarized surface of the sub-fin. A gate stack may be disposed over the fin with the gate stack contacting the planarized surface of the isolation dielectric so as to be self-aligned with the interface between the fin and sub-fin. Other embodiments may be described and/or claimed.


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