The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Apr. 06, 2016
Acm Research (Shanghai) Inc., Shanghai, CN;
Jun Wang, Shanghai, CN;
Hui Wang, Shanghai, CN;
Fufa Chen, Shanghai, CN;
Fuping Chen, Shanghai, CN;
Jian Wang, Shanghai, CN;
Xi Wang, Shanghai, CN;
Xiaoyan Zhang, Shanghai, CN;
Yinuo Jin, Shanghai, CN;
Zhaowei Jia, Shanghai, CN;
Liangzhi Xie, Shanghai, CN;
Xuejun Li, Shanghai, CN;
ACM Research (Shanghai) Inc., Changhai, CN;
Abstract
A method for cleaning a semiconductor substrate without damaging its patterned structure via an ultra/mega sonic device comprises applying liquid into a space between the substrate and the sonic device; setting an ultra/mega sonic device power supply at a frequency fand power P; and at zero output before bubble cavitation occurs; followed by at fand Pagain after bubble temperature is lowered; detecting power on time (at P, f), power off time or amplitude of each waveform output by the power supply; comparing the detected power on time with a preset time T, power off time with a preset time τ, amplitude of each waveform with a preset value, if the detected power on time is longer than τ, or power off time is shorter than τ, or amplitude of any waveform is larger than the preset value, shut down the power supply and send out an alarm.