The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 2021

Filed:

Mar. 15, 2019
Applicant:

Globalwafers Co., Ltd., Hsinchu, TW;

Inventors:

Ying-Ru Shih, Hsinchu, TW;

Chih-Yuan Chuang, Hsinchu, TW;

Chi-Tse Lee, Hsinchu, TW;

Chun-I Fan, Hsinchu, TW;

Wen-Ching Hsu, Hsinchu, TW;

Assignee:

GlobalWafers Co., Ltd., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 29/04 (2006.01); H01L 21/02 (2006.01); B32B 3/02 (2006.01); B32B 18/00 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); B32B 3/02 (2013.01); B32B 18/00 (2013.01); H01L 21/02021 (2013.01); H01L 21/26506 (2013.01); H01L 29/04 (2013.01); H01L 29/0603 (2013.01); B32B 2250/02 (2013.01); B32B 2307/20 (2013.01);
Abstract

An epitaxy substrate and a method of manufacturing the same are provided. The epitaxy substrate includes a device substrate and a handle substrate. The device substrate has a first surface and a second surface opposite to each other, and a bevel disposed between the first and the second surfaces. The handle substrate is bonded to the second surface of the device substrate, wherein the oxygen content of the device substrate is less than the oxygen content of the handle substrate, and a bonding angle greater than 90° is between the bevel of the device substrate and the handle substrate.


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