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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11183399 B1

PDFFull Text
Date of Patent:
Nov. 23, 2021

Filed:

Sep. 30, 2019

Semiconductor device and method of manufacture

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wen-Hsin Wei, Hsinchu, TW;

Hsien-Pin Hu, Zhubei, TW;

Shang-Yun Hou, Jubei, TW;

Chi-Hsi Wu, Hsinchu, TW;

Chen-Hua Yu, Hsinchu, TW;

Wen-Jung Chuang, Taichung, TW;

Chun-Che Chen, Hsinchu, TW;

Jhih-Ming Lin, Hsinchu, TW;

Chih-Ching Lin, Hsinchu, TW;

Shih-Wen Huang, Shuishang Township, TW;

Chun Hua Chang, Zhubei, TW;

Tsung-Yang Hsieh, Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Calvin Y Choi

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/3213 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H01L 23/28 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32139 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/49822 (2013.01); H01L 23/585 (2013.01); H01L 24/97 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 25/0655 (2013.01); H01L 2221/68331 (2013.01); H01L 2224/0348 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/111 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

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