The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Jan. 25, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sansaptak Dasgupta, Hillsboro, OR (US);

Han Wui Then, Portland, OR (US);

Sanaz K. Gardner, Hillsboro, OR (US);

Marko Radosavljevic, Beaverton, OR (US);

Seung Hoon Sung, Beaverton, OR (US);

Benjamin Chu-Kung, Portland, OR (US);

Robert S. Chau, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7786 (2013.01); H01L 21/0243 (2013.01); H01L 21/0254 (2013.01); H01L 21/0265 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02639 (2013.01); H01L 29/66462 (2013.01); H01L 29/0657 (2013.01); H01L 29/41725 (2013.01);
Abstract

III-N semiconductor heterostructures on III-N epitaxial islands laterally overgrown from a mesa of a silicon substrate. An IC may include a III-N semiconductor device disposed on the III-N epitaxial island overhanging the silicon mesa and may further include a silicon-based MOSFET monolithically integrated with the III-N device. Lateral epitaxial overgrowth from silicon mesas may provide III-N semiconductor regions of good crystal quality upon which transistors or other active semiconductor devices may be fabricated. Overhanging surfaces of III-N islands may provide multiple device layers on surfaces of differing polarity. Spacing between separate III-N islands may provide mechanical compliance to an IC including III-N semiconductor devices. Undercut of the silicon mesa may be utilized for transfer of III-N epitaxial islands to alternative substrates.


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