The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Sep. 14, 2017
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Paolo Tessariol, Arcore, IT;

Justin B. Dorhout, Boise, ID (US);

Indra V. Chary, Boise, ID (US);

Jun Fang, Boise, ID (US);

Matthew Park, Boise, ID (US);

Zhiqiang Xie, Meridian, ID (US);

Scott D. Stull, Boise, ID (US);

Daniel Osterberg, Boise, ID (US);

Jason Reece, Boise, ID (US);

Jian Li, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 23/528 (2006.01); H01L 27/11556 (2017.01); H01L 21/02 (2006.01); H01L 29/10 (2006.01); H01L 23/522 (2006.01); H01L 27/11575 (2017.01); H01L 27/11565 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02636 (2013.01); H01L 21/31111 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/11556 (2013.01); H01L 27/11575 (2013.01); H01L 29/1037 (2013.01); H01L 27/11565 (2013.01);
Abstract

A device comprises an array of elevationally-extending transistors and a circuit structure adjacent and electrically coupled to the elevationally-extending transistors of the array. The circuit structure comprises a stair step structure comprising vertically-alternating tiers comprising conductive steps that are at least partially elevationally separated from one another by insulative material. Operative conductive vias individually extend elevationally through one of the conductive steps at least to a bottom of the vertically-alternating tiers and individually electrically couple to an electronic component below the vertically-alternating tiers. Dummy structures individually extend elevationally through one of the conductive steps at least to the bottom of the vertically-alternating tiers. Methods are also disclosed.


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