The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

May. 27, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Yi-Wei Lee, Taoyuan, TW;

Jui-Chieh Chen, Hsinchu, TW;

Chih-Tsung Shih, Hsinchu, TW;

Tsung-Chuan Lee, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/677 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70741 (2013.01); H01L 21/0274 (2013.01); H01L 21/67721 (2013.01);
Abstract

In accordance with some embodiments, a method for processing a semiconductor wafer is provided. The method includes transporting a carrier along with a reticle supported by the carrier in a lithography exposure apparatus. The method also includes regulating particles in the carrier through a magnetic field. In addition, the method includes removing the reticle from the carrier. The method further includes performing, using the reticle, a lithography exposure process to the semiconductor wafer in the lithography exposure apparatus.


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