The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2021
Filed:
Aug. 22, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Hao-Cheng Hou, Hsinchu, TW;
Chien-Hsun Lee, Hsin-chu County, TW;
Chung-Shi Liu, Hsinchu, TW;
Jung-Wei Cheng, Hsinchu, TW;
Tsung-Ding Wang, Tainan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor package includes a semiconductor die encapsulated by an insulating encapsulation, a redistribution circuit structure disposed over the semiconductor die and the insulating encapsulation, the redistribution circuit structure being electrically connected to the semiconductor die; and a conductive feature having a first portion embedded in the redistribution circuit structure and a second portion connected to the first portion, the first portion having a first long axis and a first short axis perpendicular to the long axis in a top view, the second portion disposed over and electrically connected to the first portion. A semiconductor device having the semiconductor package, a circuit substrate and a circuit board is also provided.