The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2021

Filed:

Jun. 28, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hitoshi Kato, Oshu, JP;

Shigehiro Miura, Oshu, JP;

Hiroyuki Kikuchi, Oshu, JP;

Katsuyoshi Aikawa, Oshu, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/4409 (2013.01); C23C 16/4584 (2013.01); C23C 16/45542 (2013.01); C23C 16/45544 (2013.01); C23C 16/45551 (2013.01); H01J 37/321 (2013.01); H01J 37/32926 (2013.01); H01L 21/67253 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H01L 21/68792 (2013.01);
Abstract

A film forming apparatus includes a rotary table having a loading area at a first surface side thereof and revolving a substrate loaded on the loading area, a rotation mechanism rotating the loading area such that the substrate rotates around its axis, a processing gas supply mechanism supplying a processing gas to a processing gas supply area so that a thin film is formed on the substrate which repeatedly passes through the processing gas supply area the revolution of the substrate, and a control part configured to perform a calculation of a rotation speed of the substrate based on a parameter including a rotation speed of the rotary table to allow an orientation of the substrate to be changed whenever the substrate is positioned in the processing gas supply area, and to output a control signal for rotating the substrate at a calculated rotation speed.


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