The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Jan. 02, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seunggeol Nam, Suwon-si, KR;
Hyeonjin Shin, Suwon-si, KR;
Keunwook Shin, Yongin-si, KR;
Changhyun Kim, Seoul, KR;
Kyung-Eun Byun, Seongnam-si, KR;
Hyunjae Song, Hwaseong-si, KR;
Eunkyu Lee, Yongin-si, KR;
Changseok Lee, Seoul, KR;
Alum Jung, Suwon-si, KR;
Yeonchoo Cho, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
An interconnect structure and an electronic device including the interconnect structure are disclosed. The interconnect structure may include a metal interconnect having a bottom surface and two opposite side surfaces surrounded by a dielectric layer, a graphene layer on the metal interconnect, and a metal bonding layer providing interface adhesion between the metal interconnect and the graphene layer. The metal bonding layer includes a metal material.