The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Apr. 03, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chih-Hang Tung, Hsinchu, TW;
Tung-Liang Shao, Hsinchu, TW;
Su-Chun Yang, Hsinchu County, TW;
Geng-Ming Chang, Taichung, TW;
Chen-Hua Yu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A method for forming a chip package structure is provided. The method includes partially removing a first redistribution layer to form an alignment trench in the first redistribution layer. The alignment trench surrounds a bonding portion of the first redistribution layer. The method includes forming a liquid layer over the bonding portion. The method includes disposing a chip structure over the liquid layer, wherein a first width of the bonding portion is substantially equal to a second width of the chip structure. The method includes evaporating the liquid layer. The chip structure is in direct contact with the bonding portion after the liquid layer is evaporated.