Company Filing History:
Years Active: 2021-2025
Title: Geng-Ming Chang: Innovator in Chip Package Structures
Introduction
Geng-Ming Chang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in chip package structures. With a total of 2 patents, his work has advanced the technology used in modern electronics.
Latest Patents
Geng-Ming Chang's latest patents include innovative designs for chip package structures. One of his patents describes a chip package structure with a redistribution layer that features a bonding portion. This bonding portion includes a dielectric layer, and the structure is designed to ensure that the first width of the dielectric layer is substantially equal to the second width of the chip structure. Additionally, the chip package structure includes a protective layer that surrounds the chip structure and extends into the first redistribution layer.
Another patent focuses on a method for forming a chip package structure. This method involves partially removing a first redistribution layer to create an alignment trench that surrounds the bonding portion. The process includes forming a liquid layer over the bonding portion and disposing a chip structure over this liquid layer. After evaporating the liquid layer, the chip structure comes into direct contact with the bonding portion, ensuring a secure connection.
Career Highlights
Geng-Ming Chang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to contribute to cutting-edge technologies in chip packaging.
Collaborations
Geng-Ming Chang has collaborated with talented coworkers, including Chih-Hang Tung and Tung-Liang Shao. Their combined expertise has fostered innovation in their projects.
Conclusion
Geng-Ming Chang's contributions to chip package structures demonstrate his commitment to advancing semiconductor technology. His patents reflect a deep understanding of the complexities involved in chip packaging, making him a valuable asset in the field.