The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2021

Filed:

Oct. 07, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yen-Ru Lee, Hsinchu, TW;

Chii-Horng Li, Zhubei, TW;

Chien-I Kuo, Hsinchu, TW;

Heng-Wen Ting, Hsinchu, TW;

Jung-Chi Tai, Tainan, TW;

Li-Li Su, ZhuBei, TW;

Tzu-Ching Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/283 (2006.01); H01L 21/306 (2006.01); H01L 21/762 (2006.01); H01L 21/764 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); H01L 21/0243 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/283 (2013.01); H01L 21/30604 (2013.01); H01L 21/764 (2013.01); H01L 21/76224 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 21/3065 (2013.01); H01L 29/7848 (2013.01);
Abstract

A method includes forming a crown structure over a substrate; forming fins in the crown structure; forming an intra-device isolation region between the fins and forming inter-device isolation regions on opposing sides of the crown structure; forming a gate structure over the fins; forming a dielectric layer that extends continuously over the inter-device isolation regions, the fins and the intra-device isolation region; performing an etching process to reduce a thickness of the dielectric layer, where after the etching process, upper surfaces of the inter-device isolation regions and upper surfaces of the fins are exposed while an upper surface of the intra-device isolation region is covered by a remaining portion of the dielectric layer; and forming an epitaxial structure over the exposed upper surfaces of the fins, where after the epitaxial structure is formed, there is a void between the epitaxial structure and the intra-device isolation region.


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