The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
May. 03, 2019
Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jackson Chung Peng Kong, Tanjung Tokong, MY;
Bok Eng Cheah, Bukit Gambir, MY;
Howard L. Heck, Hillsboro, OR (US);
Seok Ling Lim, Kulim, MY;
Jenny Shio Yin Ong, Bayan Lepas, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 23/16 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2224/214 (2013.01); H01L 2225/1035 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A stiffener includes an integrated cable-header recess that couples a semiconductor package substrate flexible cable. The flexible cable connects to a device on a board without using interconnections that are arrayed through the board. A semiconductive die is coupled to the semiconductor package substrate and flexible cable through the cable-header recess.