The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Mar. 31, 2017
Intel Corporation, Santa Clara, CA (US);
Kristof Darmawikarta, Chandler, AZ (US);
Robert Alan May, Chandler, AZ (US);
Sri Ranga Sai Sai Boyapati, Chandler, AZ (US);
Wei-Lun Kane Jen, Chandler, AZ (US);
Javier Soto Gonzalez, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate comprises a multilayer substrate structure comprising a substrate interconnect, wherein the bridge die is embedded in the multilayer substrate structure. The die interconnect substrate comprises a via portion formed on the first bridge die pad of the bridge die. An average angle between a surface of the first bridge die pad and a sidewall of the via portion lies between 85° and 95°.