Chandler, AZ, United States of America

Sri Ranga Sai Sai Boyapati

USPTO Granted Patents = 5 

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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5 patents (USPTO):Explore Patents

Title: Innovations of Sri Ranga Sai Sai Boyapati

Introduction

Sri Ranga Sai Sai Boyapati is an accomplished inventor based in Chandler, AZ. He has made significant contributions to the field of electrical devices, holding a total of five patents. His work focuses on advanced substrate technologies that enhance the performance and reliability of electronic components.

Latest Patents

One of his latest patents is for a die interconnect substrate, which includes a bridge die with at least one bridge interconnect. This innovative substrate comprises a multilayer structure that integrates a substrate interconnect. The bridge die is embedded within this multilayer substrate, allowing for efficient electrical connections. The design features an electrically insulating layer made from a first insulating material, along with an insulating filler structure that utilizes a second insulating material, distinct from the first. This patent represents a significant advancement in the design and functionality of die interconnect substrates.

Career Highlights

Sri Ranga Sai Sai Boyapati is currently employed at Intel Corporation, where he continues to push the boundaries of technology. His expertise in substrate design and electrical devices has positioned him as a key player in the development of innovative solutions within the company.

Collaborations

Throughout his career, he has collaborated with notable colleagues, including Robert Alan May and Kristof Darmawikarta. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Sri Ranga Sai Sai Boyapati's contributions to the field of electrical devices and substrate technology are noteworthy. His innovative patents and collaborative efforts at Intel Corporation highlight his commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.

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