The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Mar. 31, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Roman W. Olac-Vaw, Hillsboro, OR (US);

Walid M. Hafez, Portland, OR (US);

Chia-Hong Jan, Portland, OR (US);

Hsu-Yu Chang, Hillsboro, OR (US);

Neville L. Dias, Hillsboro, OR (US);

Rahul Ramaswamy, Hillsboro, OR (US);

Nidhi Nidhi, Hillsboro, OR (US);

Chen-Guan Lee, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 29/06 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 21/823481 (2013.01); H01L 27/0886 (2013.01); H01L 28/24 (2013.01); H01L 29/0653 (2013.01);
Abstract

Techniques are disclosed for forming semiconductor structures including resistors between gates on self-aligned gate edge architecture. A semiconductor structure includes a first semiconductor fin extending in a first direction, and a second semiconductor fin adjacent to the first semiconductor fin, extending in the first direction. A first gate structure is disposed proximal to a first end of the first semiconductor fin and over the first semiconductor fin in a second direction, orthogonal to the first direction, and a second gate structure is disposed proximal to a second end of the first semiconductor fin and over the first semiconductor fin in the second direction. A first structure comprising isolation material is centered between the first and second semiconductor fins. A second structure comprising resistive material is disposed in the first structure, the second structure extending at least between the first gate structure and the second gate structure.


Find Patent Forward Citations

Loading…