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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10944051 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Jul. 30, 2019

Method of cleaning a substrate processing apparatus and the substrate processing apparatus performing the method

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Takuya Kubo, Tokyo, JP;

Song yun Kang, Tokyo, JP;

Keiichi Shimoda, Beaverton, OR (US);

Tetsuya Ohishi, Miyagi, JP;

Assignee:

Tokyo Electron Limited, Tokyo, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
B08B 5/00 (2006.01); C23F 1/02 (2006.01); H01J 37/32 (2006.01); C23F 1/08 (2006.01); H01L 43/12 (2006.01); G11B 5/84 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); G11C 11/16 (2006.01); H01F 10/32 (2006.01); H01F 41/34 (2006.01); H01L 21/66 (2006.01); H01L 27/22 (2006.01); H01L 43/02 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); G11B 5/8404 (2013.01); G11C 11/161 (2013.01); H01F 10/3259 (2013.01); H01F 41/34 (2013.01); H01J 37/32091 (2013.01); H01J 37/32724 (2013.01); H01J 37/32853 (2013.01); H01J 37/32963 (2013.01); H01L 21/67028 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H01L 21/6831 (2013.01); H01L 22/26 (2013.01); H01L 27/222 (2013.01); H01L 43/02 (2013.01); H01F 10/3272 (2013.01); H01J 37/32183 (2013.01); H01J 37/32449 (2013.01); H01J 2237/002 (2013.01); H01J 2237/24507 (2013.01); H01J 2237/327 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01); H01L 21/6833 (2013.01); H01L 43/10 (2013.01);
Abstract

A method of cleaning a substrate processing apparatus that etches a film including a metal includes (a) providing an inert gas, and removing a metal-containing deposition by plasma generated from the inert gas; and (b) after (a), providing a gas containing a fluorine-containing gas and an oxygen-containing gas, and removing a silicon-containing deposition by plasma generated from the gas containing the fluorine-containing gas and the oxygen-containing gas.

Find Patent Forward Citations

Kubo, Takuya. (2021). Method of cleaning a substrate processing apparatus and the substrate processing apparatus performing the method (U.S. Patent No. 10944051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10944051

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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