The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

Jan. 21, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chen-Hua Yu, Hsinchu, TW;

Hui-Jung Tsai, Hsinchu, TW;

Yun Chen Hsieh, Hsinchu, TW;

Hung-Jui Kuo, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); H01L 21/56 (2013.01); H01L 21/76885 (2013.01); H01L 22/20 (2013.01); H01L 24/11 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 24/45 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/214 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A semiconductor device and method includes forming a conductive post on a die; coupling a test probe to the conductive post with solder; and etching the solder and the conductive post with a plurality of etching processes, the plurality of etching processes including a first etching process, the first etching process comprising etching the conductive post with a nitric-based etchant.


Find Patent Forward Citations

Yu, Chen-Hua. (2020). Semiconductor device and method (U.S. Patent No. 10867874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10867874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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