The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Jan. 17, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Martin D. Giles, Portland, OR (US);

Annalisa Cappellani, Portland, OR (US);

Sanaz Gardner, Portland, OR (US);

Rafael Rios, Portland, OR (US);

Cory E. Weber, Hillsboro, OR (US);

Aaron A. Budrevich, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); H01L 29/45 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 27/088 (2006.01); H01L 27/092 (2006.01); H01L 29/08 (2006.01); H01L 29/165 (2006.01); H01L 29/167 (2006.01); H01L 29/06 (2006.01); H01L 21/22 (2006.01); H01L 21/225 (2006.01); H01L 21/285 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7848 (2013.01); H01L 21/2225 (2013.01); H01L 21/2254 (2013.01); H01L 21/2257 (2013.01); H01L 21/2258 (2013.01); H01L 21/28518 (2013.01); H01L 21/28556 (2013.01); H01L 21/28593 (2013.01); H01L 21/3065 (2013.01); H01L 21/30608 (2013.01); H01L 21/30617 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 27/088 (2013.01); H01L 27/092 (2013.01); H01L 29/0847 (2013.01); H01L 29/165 (2013.01); H01L 29/167 (2013.01); H01L 29/401 (2013.01); H01L 29/456 (2013.01); H01L 29/66636 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7839 (2013.01); H01L 29/7845 (2013.01); H01L 29/7851 (2013.01); H01L 29/0673 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Semiconductor devices having metallic source and drain regions are described. For example, a semiconductor device includes a gate electrode stack disposed above a semiconducting channel region of a substrate. Metallic source and drain regions are disposed above the substrate, on either side of the semiconducting channel region. Each of the metallic source and drain regions has a profile. A first semiconducting out-diffusion region is disposed in the substrate, between the semiconducting channel region and the metallic source region, and conformal with the profile of the metallic source region. A second semiconducting out-diffusion region is disposed in the substrate, between the semiconducting channel region and the metallic drain region, and conformal with the profile of the metallic drain region.


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