The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Jun. 13, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Wen-Yi Lin, New Taipei, TW;
Che-Chia Yang, Taipei, TW;
Kuang-Chun Lee, New Taipei, TW;
Yu-Sheng Lin, Zhubei, TW;
Po-Yao Lin, Hsinchu County, TW;
Shin-Puu Jeng, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A method for forming a package structure is provided. The method includes forming a first die over a first substrate, and injecting a molding compound material from a first side of the first die to a second side of the first die. The molding compound material includes a plurality of first fillers, each of the first fillers has a length along a longitudinal axis and a width along a transverse direction, and the length is greater than the width. The method further includes heating the molding compound material to form a package layer over the first die, and the first fillers are substantially parallel to each other.