The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Dec. 11, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Roie Volkovich, Hadera, IL;

Michael Adel, Ya'akov Zichron, IL;

Liran Yerushalmi, Zicron Yaacob, IL;

Eitan Herzel, Givat-Ela, IL;

Mengmeng Ye, Shanghai, CN;

Eran Amit, Haifa, IL;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01D 18/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67276 (2013.01); G01D 18/00 (2013.01); H01L 22/20 (2013.01); H01L 22/12 (2013.01);
Abstract

Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s). The zonal analysis comprises relating to spatially variable values of the setup parameter(s) and/or metrology metric(s) across one or more wafers in one or more lots. Wafer zones may be discrete or spatially continuous, and be used to weight one or more parameter(s) and/or metric(s) during any of the stages of the respective setup and measurement processes.


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