The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Aug. 28, 2015
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Shou Zen Chang, Taipei County, TW;
Chun-Lin Lu, Hsinchu, TW;
Kai-Chiang Wu, Hsinchu, TW;
Ching-Feng Yang, Taipei, TW;
Vincent Chen, Taipei, TW;
Chuei-Tang Wang, Taichung, TW;
Yen-Ping Wang, Changhua County, TW;
Hsien-Wei Chen, Hsinchu, TW;
Wei-Ting Lin, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor device includes a semiconductor die. A dielectric material surrounds the semiconductor die to form an integrated semiconductor package. There is a contact coupling to the integrated semiconductor package and configured as a ground terminal for the semiconductor package. The semiconductor device further has an EMI (Electric Magnetic Interference) shield substantially enclosing the integrated semiconductor package, wherein the EMI shield is coupled with the contact through a path disposed in the integrated semiconductor package.