The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 03, 2014
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Makoto Fukushima, Tokyo, JP;

Hozumi Yasuda, Tokyo, JP;

Keisuke Namiki, Tokyo, JP;

Osamu Nabeya, Tokyo, JP;

Shingo Togashi, Tokyo, JP;

Satoru Yamaki, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/32 (2012.01); B24B 49/16 (2006.01); H01L 21/304 (2006.01); B24B 37/005 (2012.01);
U.S. Cl.
CPC ...
B24B 37/32 (2013.01); B24B 37/005 (2013.01); B24B 49/16 (2013.01); H01L 21/304 (2013.01);
Abstract

A polishing apparatus capable of precisely controlling a polishing profile, particularly a polishing profile in an edge portion, of a wafer is disclosed. The polishing apparatus includes: a top ring shaft; a housing fixed to the top ring shaft; a flexible membrane configured to press a wafer against a polishing pad; a top ring body configured to hold the flexible membrane; a retaining ring coupled to the top ring body and disposed so as to surround the flexible membrane; a gimbal mechanism configured to allow the top ring body and the retaining ring to tilt with respect to the housing; and a local load exerting mechanism configured to exert a downward local load on a part of the retaining ring.


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