The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2020
Filed:
Sep. 09, 2018
Versum Materials Us, Llc, Tempe, AZ (US);
Hongjun Zhou, Tempe, AZ (US);
Jo-Ann Theresa Schwartz, Kennett Square, PA (US);
Malcolm Grief, Tempe, AZ (US);
Xiaobo Shi, Tempe, AZ (US);
Krishna P. Murella, Tempe, AZ (US);
Steven Charles Winchester, Tempe, AZ (US);
John Edward Quincy Hughes, Tempe, AZ (US);
Mark Leonard O'Neill, Tempe, AZ (US);
Andrew J. Dodd, Tempe, AZ (US);
Dnyanesh Chandrakant Tamboli, Tempe, AZ (US);
Reinaldo Mario Machado, Tempe, AZ (US);
VERSUM MATERIALS US, LLC, Tempe, AZ (US);
Abstract
Chemical Mechanical Planarization (CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Planarization (CMP) polishing compositions have shown excellent performance using soft polishing pad.